Studies of the mechanical and electrical properties of lead-free solder joints

Lead (Pb)-free solders for electronic packaging

Sung K. Kang, Amit Sarkhel · Journal of Electronic Materials · 1994 · 333 citations

Agriculture, Materials Engineering, Materials Science +8

Soldering in electronics

G.W.A.D. · Microelectronics Reliability · 1990 · 289 citations

Morphology of interfacial reaction between lead-free solders and electroless Ni–P under bump metallization

Jihun Jang, D. R. Frear, T. Y. Lee et al. · Journal of Applied Physics · 2000 · 192 citations

Natural Sciences, Materials Engineering, Materials Science +14

Interfacial reactions during soldering with lead-tin eutectic and lead (Pb)-free, tin-rich solders

S. K. Kang, S. Purushothaman · Journal of Electronic Materials · 1996 · 162 citations

Natural Sciences, Materials Engineering, Materials Science +12

The metal science of joining

H. K. D. H. Bhadeshia · Materials & Design (1980-2015) · 1994 · 115 citations

Engineering, Materials Engineering, Materials Science +11