Lead (Pb)-free solders for electronic packaging

Principles of Electronic Packaging

D. P. Seraphim, Ronald C. Lasky, Che‐Yu Li et al. · Journal of Electronic Packaging · 1989 · 354 citations

Agriculture, Electrical Engineering, Materials Science +12

Characterization of eutectic Sn-Bi solder joints

Z. Mei, J. W. Morris · Journal of Electronic Materials · 1992 · 315 citations

Natural Sciences, Materials Engineering, Materials Science +8

Issues in the replacement of lead-bearing solders

Paul T. Vianco, D. R. Frear · JOM · 1993 · 190 citations

Engineering, Manufacturing Engineering, Metallurgy +4

New Pb-free solder alloy with superior mechanical properties

M. McCormack, S. Jin, G. W. Kammlott et al. · Applied Physics Letters · 1993 · 189 citations

Natural Sciences, Materials Engineering, Materials Science +17

Finite element analysis for Solder Ball Connect (SBC) structural design optimization

J. S. Corbin · IBM Journal of Research and Development · 1993 · 91 citations

Engineering, Materials Engineering, Materials Science +17