Che‐Yu Li

Principles of Electronic Packaging

D. P. Seraphim, Ronald C. Lasky, Che‐Yu Li et al. · Journal of Electronic Packaging · 1989 · 354 citations

Agriculture, Electrical Engineering, Materials Science +12

Evidence for the existence of antistructure defects in bismuth telluride by density measurements

Gerald R. Miller, Che‐Yu Li · Journal of Physics and Chemistry of Solids · 1965 · 234 citations

Natural Sciences, Materials Science, Physics +13

An investigation of hardness and adhesion of sputter-deposited aluminum on silicon by utilizing a continuous indentation test

Donald S. Stone, W. R. LaFontaine, P. S. Alexopoulos et al. · Journal of materials research/Pratt's guide to venture capital sources · 1988 · 150 citations

Natural Sciences, Materials Engineering, Materials Science +14

A study of void formation in fast neutron-irradiated metals

S.D. Harkness, Che‐Yu Li · Metallurgical Transactions · 1971 · 135 citations

Engineering, Materials Engineering, Materials Science +11

Anelastic deformation of high purity aluminum at room temperature

N. Nir, Edward W. Hart, Che‐Yu Li · Scripta Metallurgica · 1976 · 128 citations

Natural Sciences, Materials Engineering, Materials Science +15