W. R. LaFontaine - Concepedia

Author

W. R. LaFontaine

Also Known As

W. LaFontaine, W. Lafontaine, W. R. LaFontaine, W. R. Lafontaine, W.R. LaFontaine, W.R. Lafontaine, William R. LaFontaine

Publications

531

Citations

H-Index

Concepts

All Affiliations

Cornell University

About

W. R. LaFontaine is an author at Cornell University specializing in engineering, mechanics of materials, and mechanical engineering.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	7	7	498
2	Materials Science	6	6	450
3	Mechanical Engineering	6	6	449
4	Applied Physics	4	4	338
5	Materials Engineering	4	4	338

W. R. LaFontaine

Publications

498

Citations

H-Index

Page 1

	Year	Citations
An investigation of hardness and adhesion of sputter-deposited aluminum on silicon by utilizing a continuous indentation test Donald S. Stone, W. R. LaFontaine, P. S. Alexopoulos, Journal of materials research/Pratt's guide to venture capital sources Materials EngineeringMaterials ScienceEngineeringMechanical EngineeringApplied Physics	1988	149
Residual stress measurements of thin aluminum metallizations by continuous indentation and x-ray stress measurement techniques W. R. LaFontaine, C. A. Paszkiet, M. A. Korhonen, Journal of materials research/Pratt's guide to venture capital sources Materials ScienceEngineeringContinuous IndentationSevere Plastic DeformationMechanical Engineering	1991	99
Analysis of thermal stress-induced grain boundary cavitation and notching in narrow Al-Si metallizations Che‐Yu Li, R. D. Black, W. R. LaFontaine Applied Physics Letters EngineeringSevere Plastic DeformationMechanical EngineeringNarrow Al-si MetallizationsWork Hardening	1988	75
Effect of residual stress and adhesion on the hardness of copper films deposited on silicon W. R. LaFontaine, B. Yost, Che‐Yu Li Journal of materials research/Pratt's guide to venture capital sources Materials EngineeringMaterials ScienceElectromigration TechniqueEngineeringSurface Science	1990	65
Stress-induced nucleation of voids in narrow aluminum-based metallizations on silicon substrates M. A. Korhonen, W. R. LaFontaine, P. Bo rgesen, Journal of Applied Physics EngineeringSevere Plastic DeformationCold WorkingSilicon SubstratesResidual Stress	1991	49
Indentation load relaxation experiments with indentation depth in the submicron range W. R. LaFontaine, B. Yost, R. D. Black, Journal of materials research/Pratt's guide to venture capital sources EngineeringMechanicsMechanical EngineeringIndentation DepthElectronic Packaging	1990	48
Solder Ball Connect (SBC) assemblies under thermal loading: II. Strain analysis via image processing, and reliability considerations Hee Cheul Choi, Yifan Guo, W. R. LaFontaine, IBM Journal of Research and Development EngineeringMechanical EngineeringWhole-field Strain DistributionMechanicsDigital Image Correlation	1993	13

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