Publication | Closed Access
Effect of residual stress and adhesion on the hardness of copper films deposited on silicon
65
Citations
8
References
1990
Year
Materials EngineeringMaterials ScienceElectromigration TechniqueEngineeringSurface ScienceApplied PhysicsMechanical EngineeringCopper FilmsMicrostructure-strength RelationshipResidual StressHardnessPlasticityThin FilmsElectronic PackagingThin Film ProcessingMicrostructure
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