P. Bo rgesen

Stress evolution due to electromigration in confined metal lines

M. A. Korhonen, P. Bo rgesen, K. N. Tu et al. · Journal of Applied Physics · 1993 · 724 citations

Engineering, Back Stresses, Chip Level +19

Microstructure based statistical model of electromigration damage in confined line metallizations in the presence of thermally induced stresses

M. A. Korhonen, P. Bo rgesen, D. D. Brown et al. · Journal of Applied Physics · 1993 · 102 citations

Engineering, Mechanical Engineering, Confined Line Metallizations +24

Thermal-stress-induced voiding in narrow, passivated Cu lines

P. Bo rgesen, J. K. Lee, R. J. Gleixner et al. · Applied Physics Letters · 1992 · 66 citations

Materials Science, Materials Engineering, Electrical Engineering +15

Do thermal spikes contribute to the ion-induced mixing of Ni into Zr, Ti, and Pd?

P. Bo rgesen, D. A. Lilienfeld, H. H. Johnson · Applied Physics Letters · 1990 · 58 citations

Materials Science, Nuclear Damage Energy, Ion Implantation +14

Stress-migration related electromigration damage mechanism in passivated, narrow interconnects

C.-Y. Li, P. Bo rgesen, Timothy D. Sullivan · Applied Physics Letters · 1991 · 50 citations

Engineering, Passivated Metal Interconnects, Interconnect (Integrated Circuits) +17