D. P. Seraphim

Principles of Electronic Packaging

D. P. Seraphim, Ronald C. Lasky, Che‐Yu Li et al. · Journal of Electronic Packaging · 1989 · 354 citations

Agriculture, Electrical Engineering, Materials Science +12

Moisture solubility and diffusion in epoxy and epoxy-glass composites

L.L. Marsh, Ronald C. Lasky, D. P. Seraphim et al. · IBM Journal of Research and Development · 1984 · 80 citations

Engineering, Materials Engineering, Materials Science +16

Phase Instability in Dilute Interstitial Solid Solutions of Nitrogen in Tantalum

D. P. Seraphim, N. R. Stemple, D. T. Novick · Journal of Applied Physics · 1962 · 61 citations

Natural Sciences, Materials Science, Physics +13

The critical temperature of superconducting alloys

D. P. Seraphim, C. Chiou, D.J. Quinn · Acta Metallurgica · 1961 · 60 citations

Natural Sciences, Materials Science, Physics +12

Magnitude of the zener relaxation effect—III anisotropy of the relaxation strength in Ag-Zn and Li-Mg solid solutions

D. P. Seraphim, A.S Nowigk · Acta Metallurgica · 1961 · 58 citations

Natural Sciences, Materials Science, Physics +12