Concepedia

Paul T. Vianco

PT

52

Publications

2.5K

Citations

25

H-Index

1987

Active since

Affiliations

Sandia National Laboratories(Current)

Sandia National Laboratories California

University of Rochester

AT&T (United States)

Nokia (United States)

Paul T. Vianco is an author at Sandia National Laboratories specializing in materials science, engineering, and materials engineering.

Top concepts

EngineeringMaterial ScienceMaterials EngineeringMicrostructureElectronic PackagingApplied PhysicsMechanical EngineeringCorrosionSurface ScienceMechanics Of Materials

Publications per year

1987–2015

52

Publications

52

Intermetallic growth and mechanical behavior of low and high melting temperature solder alloys

D. R. Frear, Paul T. Vianco · Metallurgical and Materials Transactions A · 1994 · 274 citations

Materials Science, Materials Engineering, Engineering +10

Intermetallic compound layer formation between copper and hot-dipped 100In, 50In-50Sn, 100Sn, and 63Sn-37Pb coatings

Paul T. Vianco, Paul F. Hlava, Alice C. Kilgo · Journal of Electronic Materials · 1994 · 191 citations

Materials Engineering, Materials Science, Engineering +7

Issues in the replacement of lead-bearing solders

Paul T. Vianco, D. R. Frear · JOM · 1993 · 190 citations

Defect Tolerance, Lead-bearing Solders, Lead Identification

Properties of ternary Sn-Ag-Bi solder alloys: Part I—Thermal properties and microstructural analysis

Paul T. Vianco, Jerome A. Rejent · Journal of Electronic Materials · 1999 · 137 citations

Materials Science, Materials Engineering, Part I—thermal Properties +7

Solid state intermetallic compound growth between copper and high temperature, tin-rich solders—part I: Experimental analysis

Paul T. Vianco, K.L. Erickson, P.L. Hopkins · Journal of Electronic Materials · 1994 · 129 citations

Materials Science, Materials Engineering, High Temperature Materials +9

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