Paul T. Vianco - Concepedia

Author

Paul T. Vianco

Also Known As

American Welding Society, F. Verdi, M. Grazier, M. Neilsen, P Vianco, P. T. Vianco, P. Vianco, P.T Vianco, P.T. Vianco, PAUL T. VIANCO

275

Publications

2.9K

Citations

H-Index

Concepts

All Affiliations

Sandia National Laboratories Sandia National Laboratories California University of Rochester AT&T (United States)Nokia (United States)

About

Paul T. Vianco is an author at Sandia National Laboratories specializing in materials science, engineering, and materials engineering.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	24	46	2.2K
2	Applied Physics	16	20	918
3	Electrical Engineering	5	5	145
4	Chemistry	3	3	236
5	Chemical Engineering	2	2	45

Paul T. Vianco

Publications

2.5K

Citations

H-Index

Page 1

	Year	Citations
Intermetallic growth and mechanical behavior of low and high melting temperature solder alloys D. R. Frear, Paul T. Vianco Metallurgical and Materials Transactions A Materials ScienceMaterials EngineeringEngineeringMechanical BehaviorMechanical Engineering	1994	274
Intermetallic compound layer formation between copper and hot-dipped 100In, 50In-50Sn, 100Sn, and 63Sn-37Pb coatings Paul T. Vianco, Paul F. Hlava, Alice C. Kilgo Journal of Electronic Materials Materials EngineeringMaterials ScienceEngineeringSurface ProcessingSurface Science	1994	191
Issues in the replacement of lead-bearing solders Paul T. Vianco, D. R. Frear JOM Defect ToleranceLead-bearing SoldersLead Identification	1993	190
Properties of ternary Sn-Ag-Bi solder alloys: Part I—Thermal properties and microstructural analysis Paul T. Vianco, Jerome A. Rejent Journal of Electronic Materials Materials ScienceMaterials EngineeringPart I—thermal PropertiesEngineeringMicrostructural Analysis	1999	137
Solid state intermetallic compound growth between copper and high temperature, tin-rich solders—part I: Experimental analysis Paul T. Vianco, K.L. Erickson, P.L. Hopkins Journal of Electronic Materials Materials ScienceMaterials EngineeringHigh Temperature MaterialsEngineeringExperimental Analysis	1994	129
Properties of ternary Sn-Ag-Bi solder alloys: Part II—Wettability and mechanical properties analyses Paul T. Vianco, Jerome A. Rejent Journal of Electronic Materials Materials ScienceMaterials EngineeringEngineeringMechanical Properties AnalysesMechanical Engineering	1999	108
Solid-state intermetallic compound layer growth between copper and 95.5Sn-3.9Ag-0.6Cu solder Paul T. Vianco, Jerome A. Rejent, Paul F. Hlava Journal of Electronic Materials Materials EngineeringMaterials ScienceEngineeringApplied PhysicsMetallurgical Interaction	2004	91
Evaluation of Lead- Free Solder Joints in Electronic Assemblies I. Artaki, A.M. Jackson, Paul T. Vianco Journal of Electronic Materials Materials ScienceFriction WeldingEngineeringAdvanced Packaging (Semiconductors)Corrosion	1994	88
Acceleration models, constitutive equations, and reliability of lead-free solders and joints John H. Lau, W. Danksher, Paul T. Vianco Materials ScienceEngineeringAcceleration ModelsMechanicsMechanical Engineering	2004	86
Intermetallic compound layer growth by solid state reactions between 58Bi-42Sn solder and copper Paul T. Vianco, A. C. Kilgo, R.J. Grant Journal of Electronic Materials Materials EngineeringMaterials ScienceSolid State ReactionsEngineeringSuperalloy	1995	79

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