Concepedia

Jerome A. Rejent

JA

Statistics

Publications

21

Citations

911

H-Index

15

Active since

1996

Affiliations

Sandia National Laboratories(Current)

Sandia National Laboratories California

Jerome A. Rejent is an author at Sandia National Laboratories specializing in engineering, materials science, and materials engineering.

Top concepts

EngineeringMaterial ScienceMicrostructureMaterials EngineeringElectronic PackagingApplied PhysicsMechanical EngineeringCorrosionMechanics Of MaterialsAlloys

Publications per year

1996–2015

21

Publications

21

Properties of ternary Sn-Ag-Bi solder alloys: Part I—Thermal properties and microstructural analysis

Paul T. Vianco, Jerome A. Rejent · Journal of Electronic Materials · 1999 · 137 citations

Materials Science, Materials Engineering, Part I—thermal Properties +7

Properties of ternary Sn-Ag-Bi solder alloys: Part II—Wettability and mechanical properties analyses

Paul T. Vianco, Jerome A. Rejent · Journal of Electronic Materials · 1999 · 108 citations

Materials Science, Materials Engineering, Engineering +7

Solid-state intermetallic compound layer growth between copper and 95.5Sn-3.9Ag-0.6Cu solder

Paul T. Vianco, Jerome A. Rejent, Paul F. Hlava · Journal of Electronic Materials · 2004 · 91 citations

Materials Engineering, Materials Science, Engineering +7

Creep behavior of the ternary 95.5Sn-3.9Ag-0.6Cu solder: Part II—Aged condition

Paul T. Vianco, Jerome A. Rejent, Alice C. Kilgo · Journal of Electronic Materials · 2004 · 70 citations

Materials Science, Materials Engineering, Engineering +7

Time-independent mechanical and physical properties of the ternary 95.5Sn-3.9Ag-0.6Cu solder

Paul T. Vianco, Jerome A. Rejent, Alice C. Kilgo · Journal of Electronic Materials · 2003 · 68 citations

Materials Science, Materials Engineering, Engineering +11

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