Solid-state intermetallic compound layer growth between copper and 95.5Sn-3.9Ag-0.6Cu solder - Concepedia

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Solid-state intermetallic compound layer growth between copper and 95.5Sn-3.9Ag-0.6Cu solder

91

Citations

3

References

2004

Year

Paul T. Vianco, Jerome A. Rejent, Paul F. Hlava

Journal of Electronic Materials

Materials EngineeringMaterials ScienceEngineeringApplied PhysicsMetallurgical InteractionElectronic PackagingAlloy PhaseCladding (Metalworking)MicrostructureMetal Processing

References

	Year	Citations

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