Properties of ternary Sn-Ag-Bi solder alloys: Part II—Wettability and mechanical properties analyses - Concepedia

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Properties of ternary Sn-Ag-Bi solder alloys: Part II—Wettability and mechanical properties analyses

108

Citations

3

References

1999

Year

Paul T. Vianco, Jerome A. Rejent

Journal of Electronic Materials

Materials ScienceMaterials EngineeringEngineeringMechanical Properties AnalysesMechanical EngineeringAlloy DesignPart Ii—wettabilityAlloy PhaseMicrostructureAlloys

References

	Year	Citations

Page 1