Ted W. Lichoulas

A Novel Approach to Photonic Packaging Leveraging Existing High-Throughput Microelectronic Facilities

Tymon Barwicz, Yoichi Taira, Ted W. Lichoulas et al. · IEEE Journal of Selected Topics in Quantum Electronics · 2016 · 93 citations

Optical Materials, Engineering, Device Integration +21

Automated, high-throughput photonic packaging

Tymon Barwicz, Ted W. Lichoulas, Yoichi Taira et al. · Optical Fiber Technology · 2018 · 55 citations · Full text

Automated, self-aligned assembly of 12 fibers per nanophotonic chip with standard microelectronics assembly tooling

Tymon Barwicz, Nicolas Boyer, Stephane Harel et al. · 2015 · 27 citations

Engineering, Biomedical Engineering, Micro-optical Component +22

A Metamaterial Converter Centered at 1490nm for Interfacing Standard Fibers to Nanophotonic Waveguides

Tymon Barwicz, Nicolas Boyer, Alexander Janta-Polczynski et al. · Optical Fiber Communication Conference · 2016 · 20 citations

Engineering, Optical Transmission System, Metasurfaces +17

Novel, High-Throughput, Fiber-to-Chip Assembly Employing Only Off-the-Shelf Components

Nicolas Boyer, Alexander Janta-Polczynski, Jean-François Morissette et al. · 2017 · 18 citations

Engineering, Biomedical Engineering, Fiber-to-chip Assembly Employing +19