Nicolas Boyer

A Novel Approach to Photonic Packaging Leveraging Existing High-Throughput Microelectronic Facilities

Tymon Barwicz, Yoichi Taira, Ted W. Lichoulas et al. · IEEE Journal of Selected Topics in Quantum Electronics · 2016 · 93 citations

Optical Materials, Engineering, Device Integration +21

Integrated Metamaterial Interfaces for Self-Aligned Fiber-to-Chip Coupling in Volume Manufacturing

Tymon Barwicz, Bo Peng, Robert Leidy et al. · IEEE Journal of Selected Topics in Quantum Electronics · 2018 · 65 citations

Waveguides, Engineering, Device Integration +24

Automated, high-throughput photonic packaging

Tymon Barwicz, Ted W. Lichoulas, Yoichi Taira et al. · Optical Fiber Technology · 2018 · 55 citations · Full text

Underfill delamination to chip sidewall in advanced flip chip packages

M.-C. Paquet, Julien Sylvestre, Emmanuelle Gros et al. · 2009 · 33 citations

Advanced Packaging, Materials Science, Chip-scale Package +13

Assembly of mechanically compliant interfaces between optical fibers and nanophotonic chips

Tymon Barwicz, Yoichi Taira, Hidetoshi Numata et al. · 2014 · 29 citations

Optical Materials, Engineering, Nanophotonic Chips +21