Shantanu Deshpande

Computational and Experimental Study of Phenolic Resins: Thermal–Mechanical Properties and the Role of Hydrogen Bonding

Joshua Monk, Eric W. Bucholz, T. Boghozian et al. · Macromolecules · 2015 · 65 citations

Natural Sciences, Materials Engineering, Materials Science +17

Microstructural Indicators for Prognostication of Copper–Aluminum Wire Bond Reliability Under High-Temperature Storage and Temperature Humidity

Pradeep Lall, Shantanu Deshpande, Luu Nguyen et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2016 · 26 citations

Natural Sciences, Materials Engineering, Materials Science +17

Reliability of Copper, Gold, Silver, and PCC Wirebonds Subjected to Harsh Environment

Pradeep Lall, Shantanu Deshpande, Luu Nguyen · 2018 · 26 citations

Engineering, Materials Engineering, Materials Science +17

Non-destructive crack and defect detection in SAC solder interconnects using cross-sectioning and X-ray micro-CT

Pradeep Lall, Shantanu Deshpande, Junchao Wei et al. · 2014 · 21 citations

Veterinary Medicine, Materials Engineering, Materials Science +16

Prognostication of copper-aluminum wirebond reliability under high temperature storage and temperature-humidity

Pradeep Lall, Shantanu Deshpande, Luu Nguyen et al. · 2014 · 13 citations

Natural Sciences, Materials Engineering, Materials Science +17