Jeff Suhling

Solder Joint Reliability in Electronics Under Shock and Vibration Using Explicit Finite-Element Submodeling

Pradeep Lall, Sameep Gupte, Prakriti Choudhary et al. · IEEE Transactions on Electronics Packaging Manufacturing · 2007 · 123 citations

Engineering, Materials Science, Finite Element Analysis +15

Prognostics and Health Management of Electronic Packaging

Pradeep Lall, Md Nazmul Islam, M. Kaysar Rahim et al. · IEEE Transactions on Components and Packaging Technologies · 2006 · 110 citations

Engineering, Electrical Engineering, Materials Engineering +17

Health Monitoring for Damage Initiation & Progression during Mechanical Shock in Electronic Assemblies

Pradeep Lall, P. Choudhary, Sameep Gupte et al. · 2006 · 88 citations

Engineering, Electrical Engineering, Mechanical Engineering +17

Reliability and life study of hydraulic solenoid valve. Part 1: A multi-physics finite element model

Santosh Angadi, Robert L. Jackson, Song-Yul Choe et al. · Engineering Failure Analysis · 2008 · 85 citations

Engineering, Computational Engineering, Mechanical Engineering +16

Failure-Envelope Approach to Modeling Shock and Vibration Survivability of Electronic and MEMS Packaging

Pradeep Lall, Dhananjay Panchagade, P. Choudhary et al. · 2005 · 83 citations

Engineering, Electrical Engineering, Mechanical Behavior Of Materials +16