Sameep Gupte

Solder Joint Reliability in Electronics Under Shock and Vibration Using Explicit Finite-Element Submodeling

Pradeep Lall, Sameep Gupte, Prakriti Choudhary et al. · IEEE Transactions on Electronics Packaging Manufacturing · 2007 · 123 citations

Engineering, Impact (Mechanics), Impact Loading +25

Health Monitoring for Damage Initiation & Progression during Mechanical Shock in Electronic Assemblies

Pradeep Lall, P. Choudhary, Sameep Gupte et al. · 2006 · 88 citations

Engineering, Mechanical Engineering, Safety Science +21

Failure-Envelope Approach to Modeling Shock and Vibration Survivability of Electronic and MEMS Packaging

Pradeep Lall, Dhananjay Panchagade, P. Choudhary et al. · 2005 · 83 citations

Failure Envelope, Reliability Engineering, Engineering +15

Statistical Pattern Recognition and Built-in Reliability Test for Feature Extraction and Health Monitoring of Electronics under Shock Loads

Pradeep Lall, Prakriti Choudhary, Sameep Gupte et al. · 2007 · 82 citations

Fault Diagnosis, Engineering, Mechanical Engineering +24

Failure-Envelope Approach to Modeling Shock and Vibration Survivability of Electronic and MEMS Packaging

Pradeep Lall, Dhananjay Panchagade, Prakriti Choudhary et al. · IEEE Transactions on Components and Packaging Technologies · 2008 · 69 citations

Engineering, Mechanical Engineering, Micro-electromechanical System +17