M. Kaysar Rahim

Prognostics and Health Management of Electronic Packaging

Pradeep Lall, Md Nazmul Islam, M. Kaysar Rahim et al. · IEEE Transactions on Components and Packaging Technologies · 2006 · 110 citations

Engineering, Complex Systems, Reliability Engineering +17

Die stress characterization in flip chip on laminate assemblies

M. Kaysar Rahim, Jeffrey C. Suhling, D. Scott Copeland et al. · IEEE Transactions on Components and Packaging Technologies · 2005 · 46 citations

Materials Science, Flip Chip, Chip-scale Package +11

Fundamentals of delamination initiation and growth in flip chip assemblies

M. Kaysar Rahim, Jeffrey C. Suhling, R.C. Jaeger et al. · 2005 · 42 citations

Engineering, Mechanical Engineering, Advanced Packaging (Semiconductors) +20

Continuous In-Situ Die Stress Measurements During Thermal Cycling Accelerated Life Testing

M. Kaysar Rahim, Jordan C. Roberts, Jeffrey C. Suhling et al. · 2007 · 32 citations

Engineering, Life Prediction, Mechanical Engineering +21

Measurement of thermally induced die stresses in flip chip on laminate assemblies

M. Kaysar Rahim, Jeffrey C. Suhling, D. Scott Copeland et al. · 2004 · 30 citations

Engineering, Mechanical Engineering, Laminate Assemblies +16