D.C. Abbott

The root cause of black pad failure of solder joints with electroless Ni/Immersion gold plating

Kejun Zeng, R.J. Stierman, D.C. Abbott et al. · JOM · 2006 · 81 citations

Materials Science, Materials Engineering, Engineering +6

Palladium as a lead finish for surface mount integrated circuit packages

D.C. Abbott, R.M. Brook, N. McLelland et al. · IEEE Transactions on Components Hybrids and Manufacturing Technology · 1991 · 43 citations

Engineering, Lead Finish Performance, Solder Joint Metallurgy +16

Time- and temperature-dependent wetting behavior of eutectic SnPb on Cu leadframes plated with Pd/Ni and Au/Pd/Ni thin films

P. G. Kim, K. N. Tu, D.C. Abbott · Journal of Applied Physics · 1998 · 29 citations

Engineering, Surface Nanotechnology, Chemical Deposition +17

Root Cause of Black Pad Failure of Solder Joints with Electroless Nickel/Immersion Gold Plating

Kejun Zeng, R.J. Stierman, D.C. Abbott et al. · 2006 · 19 citations

Materials Science, Materials Engineering, Electrical Engineering +15

Nickel/palladium finish for leadframes

D.C. Abbott · IEEE Transactions on Components and Packaging Technologies · 1999 · 16 citations

Materials Engineering, Materials Science, Metal Processing +10