E.T. Ogawa

Electromigration reliability issues in dual-damascene Cu interconnections

E.T. Ogawa, Ki‐Don Lee, V. Blaschke et al. · IEEE Transactions on Reliability · 2002 · 271 citations

Materials Science, Materials Engineering, Electrical Engineering +15

Stress-induced voiding under vias connected to wide Cu metal leads

E.T. Ogawa, J. W. McPherson, J. Rosal et al. · 2003 · 149 citations

Engineering, Severe Plastic Deformation, Mechanical Engineering +17

Leakage, breakdown, and TDDB characteristics of porous low-k silica-based interconnect dielectrics

E.T. Ogawa, Jin‐Young Kim, Gaddi S. Haase et al. · 2003 · 115 citations

Engineering, Silicon On Insulator, Failure Kinetics +18

Statistics of electromigration early failures in Cu/oxide dual-damascene interconnects

E.T. Ogawa, K.-D. Lee, Hideki Matsuhashi et al. · 2002 · 51 citations

Engineering, Interconnect (Integrated Circuits), Failure Behavior +17

Interface Reliability Assessments for Copper/Low-k Products

Cheryl Hartfield, E.T. Ogawa, Y.-J. Park et al. · IEEE Transactions on Device and Materials Reliability · 2004 · 48 citations

Engineering, Package Reliability, Reliability Engineering +17