Concepedia

Author

E.T. Ogawa

Texas Instruments (United States)ORCID

Also Known As

E Ogawa, E. Ogawa, E.T. Ogawa, Eri Ogawa

21

Publications

740

Citations

9

H-Index

21

Concepts

All Affiliations

Texas Instruments (United States)The University of Texas at AustinConexant (United States)
EO

About

E.T. Ogawa is an author at Texas Instruments (United States) specializing in engineering, electronic packaging, and microelectronics.

Top Concepts

#ConceptH-IndexPublicationsCitations

1

Engineering

8

8

707

2

Materials Science

8

8

707

3

Applied Physics

7

7

659

4

Electrical Engineering

7

7

558

5

Materials Engineering

7

7

695

E.T. Ogawa

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9

Publications

718

Citations

9

H-Index

YearCitations

Electromigration reliability issues in dual-damascene Cu interconnections

E.T. Ogawa, Ki‐Don Lee, V. Blaschke,

IEEE Transactions on Reliability

2002

271

Stress-induced voiding under vias connected to wide Cu metal leads

E.T. Ogawa, J. W. McPherson, J. Rosal,

2003

149

Leakage, breakdown, and TDDB characteristics of porous low-k silica-based interconnect dielectrics

E.T. Ogawa, Jin‐Young Kim, Gaddi S. Haase,

2003

115

Statistics of electromigration early failures in Cu/oxide dual-damascene interconnects

E.T. Ogawa, K.-D. Lee, Hideki Matsuhashi,

2002

51

Interface Reliability Assessments for Copper/Low-k Products

Cheryl Hartfield, E.T. Ogawa, Y.-J. Park,

IEEE Transactions on Device and Materials Reliability

2004

48

Breakdown characteristics of interconnect dielectrics

Gaddi Hasse, E.T. Ogawa, J. W. McPherson

2005

32

Electromigration study of Cu/low k dual-damascene interconnects

K.-D. Lee, Xiaoyu Lu, E.T. Ogawa,

2003

29

Electromigration threshold for Cu/low k interconnects

Ki‐Don Lee, E.T. Ogawa, Sujin Yoon,

2004

12

Electromigration reliability of dual damascene Cu/CVD SiOC interconnects

Ming-Hsien Tsai, R. Augur, V. Blaschke,

2001

11

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