V. Blaschke

Electromigration reliability issues in dual-damascene Cu interconnections

E.T. Ogawa, Ki‐Don Lee, V. Blaschke et al. · IEEE Transactions on Reliability · 2002 · 271 citations

Materials Science, Materials Engineering, Electrical Engineering +15

Permittivity characterization of low-k thin films from transmission-line measurements

Michael D. Janezic, Dylan F. Williams, V. Blaschke et al. · IEEE Transactions on Microwave Theory and Techniques · 2003 · 94 citations

Electrical Engineering, Engineering, Broad-band Technique +10

Electromigration critical length effect in Cu/oxide dual-damascene interconnects

Ki-Don Lee, Ennis T. Ogawa, Hideki Matsuhashi et al. · Applied Physics Letters · 2001 · 86 citations

Materials Science, Electrical Engineering, Critical Length Effect +13

Direct observation of a critical length effect in dual-damascene Cu/oxide interconnects

Ennis T. Ogawa, Alexander J. Bierwag, Ki-Don Lee et al. · Applied Physics Letters · 2001 · 68 citations

Engineering, Integrated Circuits, Dual-damascene Cu/oxide Interconnects +17

Statistics of electromigration early failures in Cu/oxide dual-damascene interconnects

E.T. Ogawa, K.-D. Lee, Hideki Matsuhashi et al. · 2002 · 51 citations

Engineering, Interconnect (Integrated Circuits), Failure Behavior +17