Jie-Hua Zhao - Concepedia

Author

Jie-Hua Zhao

Texas Instruments (United States)

Also Known As

Jie-Hua Zhao

Publications

1.1K

Citations

H-Index

Concepts

All Affiliations

Texas Instruments (United States)The University of Texas at Austin Motorola (United States)Lamar University

About

Jie-Hua Zhao is an author at Texas Instruments (United States) specializing in engineering, materials science, and electronic packaging.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	17	21	1K
2	Applied Physics	10	10	708
3	Computer Engineering	4	4	58
4	Chemical Engineering	2	2	124
5	Chemistry	1	1	42

Jie-Hua Zhao

Publications

Citations

H-Index

Page 1

	Year	Citations
Low Dielectric Constant Materials for ULSI Interconnects Michael Morgen, E. Todd Ryan, Jie-Hua Zhao, Annual Review of Materials Science EngineeringIntegrated CircuitsUlsi InterconnectsLow Dielectric ConstantInterconnect (Integrated Circuits)	2000	385
Dual stage modeling of moisture absorption and desorption in epoxy mold compounds Mark D. Placette, Xuejun Fan, Jie-Hua Zhao, Microelectronics Reliability Materials ScienceMold ControlChemical EngineeringEngineeringDesiccation	2012	82
Experimental Evaluations of the Strength of Silicon Die by 3-Point-Bend Versus Ball-on-Ring Tests Jie-Hua Zhao, John Tellkamp, Vijay Gupta, IEEE Transactions on Electronics Packaging Manufacturing EngineeringMechanical EngineeringSilicon On InsulatorDefect ToleranceExperimental Evaluations	2009	62
Thermomechanical properties and moisture uptake characteristics of hydrogen silsesquioxane submicron films Jie-Hua Zhao, Irfan Malik, Todd Ryan, Applied Physics Letters Materials ScienceMaterials EngineeringThermomechanical PropertiesMoisture UptakeEngineering	1999	54
Thermomechanical property of diffusion barrier layer and its effect on the stress characteristics of copper submicron interconnect structures Jie-Hua Zhao, Wenjie Qi, Paul S. Ho Microelectronics Reliability Materials ScienceMaterials EngineeringDiffusion Barrier LayerElectromigration TechniqueEngineering	2002	44
A dual stage model of anomalous moisture diffusion and desorption in epoxy mold compounds Mark D. Placette, Xuejun Fan, Jie-Hua Zhao, Materials ScienceChemical EngineeringSecond StageAnomalous Moisture DiffusionEngineering	2011	42
Microstructure-Based Stress Modeling of Tin Whisker Growth Jie-Hua Zhao, Peng Su, Min Ding, IEEE Transactions on Electronics Packaging Manufacturing Materials ScienceTin Whisker GrowthEngineeringSevere Plastic DeformationMechanical Engineering	2006	39
On-wafer characterization of thermomechanical properties of dielectric thin films by a bending beam technique Jie-Hua Zhao, Todd Ryan, Paul S. Ho, Journal of Applied Physics Bending Beam TechniqueThin Film PhysicsThermomechanical PropertiesEngineeringThin Film Process Technology	2000	38
Effect of Dicing Technique on the Fracture Strength of Si Dies With Emphasis on Multimodal Failure Distribution Seung‐Hyun Chae, Jie-Hua Zhao, Darvin Edwards, IEEE Transactions on Device and Materials Reliability EngineeringDicing TechniqueMechanical EngineeringMultimodal Failure DistributionDefect Tolerance	2009	33
Thermal deformation analysis on flip-chip packages using high resolution moire interferometry Guotao Wang, Jie-Hua Zhao, Min Ding, EngineeringMechanical EngineeringFlip-chip PackagesMoire InterferometryAdvanced Packaging (Semiconductors)	2003	28

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