Concepedia

Jie-Hua Zhao

JZ

23

Publications

1K

Citations

17

H-Index

1999

Active since

Affiliations

Texas Instruments (United States)(Current)

The University of Texas at Austin

Motorola (United States)

Lamar University

Jie-Hua Zhao is an author at Texas Instruments (United States) specializing in engineering, materials science, and electronic packaging.

Top concepts

EngineeringMaterial ScienceElectronic PackagingMicroelectronicsMechanical EngineeringMechanics Of MaterialsApplied PhysicsSolid MechanicsElectrical EngineeringMicrostructure

Publications per year

1999–2012

23

Publications

23

Low Dielectric Constant Materials for ULSI Interconnects

Michael Morgen, E. Todd Ryan, Jie-Hua Zhao et al. · Annual Review of Materials Science · 2000 · 385 citations

Engineering, Integrated Circuits, Ulsi Interconnects +16

Dual stage modeling of moisture absorption and desorption in epoxy mold compounds

Mark D. Placette, Xuejun Fan, Jie-Hua Zhao et al. · Microelectronics Reliability · 2012 · 82 citations

Materials Science, Mold Control, Chemical Engineering +7

Experimental Evaluations of the Strength of Silicon Die by 3-Point-Bend Versus Ball-on-Ring Tests

Jie-Hua Zhao, John Tellkamp, Vijay Gupta et al. · IEEE Transactions on Electronics Packaging Manufacturing · 2009 · 62 citations

Engineering, Mechanical Engineering, Silicon On Insulator +19

Thermomechanical properties and moisture uptake characteristics of hydrogen silsesquioxane submicron films

Jie-Hua Zhao, Irfan Malik, Todd Ryan et al. · Applied Physics Letters · 1999 · 54 citations

Materials Science, Materials Engineering, Thermomechanical Properties +14

Thermomechanical property of diffusion barrier layer and its effect on the stress characteristics of copper submicron interconnect structures

Jie-Hua Zhao, Wenjie Qi, Paul S. Ho · Microelectronics Reliability · 2002 · 44 citations

Materials Science, Materials Engineering, Diffusion Barrier Layer +14

Rows per page

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