Thermomechanical property of diffusion barrier layer and its effect on the stress characteristics of copper submicron interconnect structures

Structure and properties of TiN coatings

J.‐E. Sundgren · Thin Solid Films · 1985 · 897 citations

Materials Science, Materials Engineering, Engineering +5

Elastic constants of single-crystal transition-metal nitride films measured by line-focus acoustic microscopy

J. O. Kim, J. D. Achenbach, Paul B. Mirkarimi et al. · Journal of Applied Physics · 1992 · 337 citations · Full text

Engineering, Acoustic Metamaterial, Mechanical Engineering +20

Thermal expansion and lattice parameters of group IV semiconductors

Robert R. Reeber, Kai Wang · Materials Chemistry and Physics · 1996 · 162 citations

Semiconductors, Ii-vi Semiconductor, Physics +3

Stress-Induced Phenomena In Metallization

Paul S. Ho, C.Y. Li, P. A. Totta · 1994 · 159 citations

Materials Science, Vlsi Fabrication Technology, Electromigration Technique +13

Stresses, curvatures, and shape changes arising from patterned lines on silicon wafers

Yulin Shen, S. Suresh, I. A. Blech · Journal of Applied Physics · 1996 · 152 citations

Engineering, Mechanical Engineering, Silicon On Insulator +17