Stress-Induced Phenomena In Metallization

Abstract

These proceedings represent papers presented at the Second International Workshop on Stress Induced Phenomena in Metallization held on March 29-31, 1993 at the University of Texas at Austin, U.S.A. The papers included in this volume discuss stress-induced void formation and electromigration failures in narrow-line inter-connect metallization. The results presented have a direct relevance to VLSI fabrication technology. The symposium was sponsored by the American Vacuum Society, the Japanese Society of Applied Physics and the University of Texas at Austin. (AIP)