Ivo J. Raaijmakers

Reactively sputtered TiN as a diffusion barrier between Cu and Si

Shiqing Wang, Ivo J. Raaijmakers, Brad J. Burrow et al. · Journal of Applied Physics · 1990 · 244 citations

Engineering, Sputtered Tin, Thin Film Process Technology +19

A theoretical study and experimental investigation of non-LTE phenomena in an inductively-coupled argon plasma—I. Characterization of the discharge

Ivo J. Raaijmakers, P.W.J.M. Boumans, B. van der Sijde et al. · Spectrochimica Acta Part B Atomic Spectroscopy · 1983 · 97 citations

Electrical Engineering, Theoretical Study, Engineering +9

The effect of density and microstructure on the performance of TiN barrier films in Cu metallization

Ki-Chul Park, Ki‐Bum Kim, Ivo J. Raaijmakers · Journal of Applied Physics · 1996 · 92 citations

Engineering, Thin Film Process Technology, Chemical Deposition +17

Low temperature metal-organic chemical vapor deposition of advanced barrier layers for the microelectronics industry

Ivo J. Raaijmakers · Thin Solid Films · 1994 · 73 citations

Materials Science, Engineering, Thermal Barrier Coating +8

The formation of an amorphous silicide by thermal reaction of sputter-deposited Ti and Si layers

Ivo J. Raaijmakers, A. H. Reader, P.H. Oosting · Journal of Applied Physics · 1988 · 67 citations

Engineering, Chemistry, Silicon On Insulator +17