Shiqing Wang

Reactively sputtered TiN as a diffusion barrier between Cu and Si

Shiqing Wang, Ivo J. Raaijmakers, Brad J. Burrow et al. · Journal of Applied Physics · 1990 · 244 citations

Engineering, Sputtered Tin, Thin Film Process Technology +19

Molecular insights into the interactions between chloride liquids and C S H nanopore surfaces under electric field-induced transport

Yongqing Chen, Mingyue Chen, Xin-yang Tong et al. · Journal of Molecular Liquids · 2022 · 29 citations

Engineering, Electric Field-induced Transport, Nanotechnology +8

Tribological properties of corrosion-resistant GLC/CrCN multilayer coatings

Shenming Zhao, Shiqing Wang, Bo Liu et al. · Surface and Coatings Technology · 2025 · 17 citations

Frictional heat induced morphological responses at the interface in rotary friction welding of austenitic alloys: corona-bond and heat-pattern

Feng Jin, Junmiao Shi, Guodong Wen et al. · Journal of Materials Research and Technology · 2023 · 13 citations · Full text

Effect of laser power on microstructure and mechanical properties of K418 nickel-based alloy prepared by selective laser melting

Yongxin Lu, Yuwei Zhou, Pengjun Wen et al. · Journal of Materials Research and Technology · 2023 · 13 citations · Full text