Xuejun Fan - Concepedia

Author

Xuejun Fan

Lamar University ORCID

Also Known As

Fan Xuejun, Fan, X., Fan, X. J., Fan, Xuejun, X Fan, X. Fan, X. J. Fan, X.-J. Fan, X.J. Fan, XUEJUN FAN

437

Publications

7.2K

Citations

H-Index

192

Concepts

All Affiliations

Lamar University Delft University of Technology Chinese Academy of Sciences Hohai University Institute of Semiconductors

About

Xuejun Fan is an author at Lamar University specializing in engineering, electronic packaging, and mechanical engineering.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	37	140	4.4K
2	Applied Physics	22	45	1.2K
3	Natural Sciences	4	4	143
4	Education	1	1	13
5	Health Sciences	1	1	37

Xuejun Fan

172

Publications

5.8K

Citations

H-Index

Page 1

	Year	Citations
Heat Transfer of Aviation Kerosene at Supercritical Conditions Fengquan Zhong, Xuejun Fan, Yu Gong, Journal of Thermophysics and Heat Transfer	2009	223
Recent advances in 2D/nanostructured metal sulfide-based gas sensors: mechanisms, applications, and perspectives Hongyu Tang, Leandro Sacco, Sten Vollebregt, Journal of Materials Chemistry A	2020	207
Experimental investigations and model study of moisture behaviors in polymeric materials Xuejun Fan, S. W. Ricky Lee, Qiang Han Microelectronics Reliability Materials ScienceEngineeringDesiccationExperimental InvestigationsPolymer Stability	2009	168
Ultra-High Sensitive NO<sub>2</sub> Gas Sensor Based on Tunable Polarity Transport in CVD-WS<sub>2</sub>/IGZO p-N Heterojunction Hongyu Tang, Yutao Li, Robert Sokolovskij, ACS Applied Materials & Interfaces	2019	134
Interfacial Delamination Mechanisms During Soldering Reflow With Moisture Preconditioning Xuejun Fan, G.Q. Zhang, W.D. van Driel, IEEE Transactions on Components and Packaging Technologies Moisture DiffusionEngineeringFlip Chip PackagesRefrigerationDesiccation	2008	106
Design and optimization of thermo-mechanical reliability in wafer level packaging Xuejun Fan, Bhavesh Varia, Qiang Han Microelectronics Reliability Materials ScienceReliability EngineeringEngineeringChip-scale PackageAdvanced Packaging (Semiconductors)	2010	105
PoF-Simulation-Assisted Reliability Prediction for Electrolytic Capacitor in LED Drivers Bo Sun, Xuejun Fan, Cheng Qian, IEEE Transactions on Industrial Electronics ReliabilityOutput Stage CapacitorElectrical EngineeringReliability EngineeringLed Drivers	2016	104
High Selective Gas Detection for small molecules based on Germanium selenide monolayer Lian Liu, Qun Yang, Zeping Wang, Applied Surface Science EngineeringNanotechnologySpectroscopySurface ScienceApplied Physics	2017	90
Investigation of the underfill delamination and cracking in flip-chip modules under temperature cyclic loading Xuejun Fan, H.B. Wang, T.B. Lim IEEE Transactions on Components and Packaging Technologies EngineeringUnderfill DelaminationMechanical EngineeringAdvanced Packaging (Semiconductors)Underfilled Solder Ball	2001	88
Degradation of optical materials in solid-state lighting systems M. Yazdan Mehr, Abbas Bahrami, W.D. van Driel, International Materials Reviews	2019	85

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