Concepedia

Huang-Lin Chao

HC

4

Publications

82

Citations

4

H-Index

2006

Active since

Affiliations

The University of Texas at Austin(Current)

Huang-Lin Chao is an author at The University of Texas at Austin specializing in materials science, electronic packaging, and electrical engineering.

Top concepts

EngineeringMaterial ScienceMicroelectronicsElectronic PackagingElectrical EngineeringCorrosionApplied Physics3D PrintingMicrostructureNanolithography

Publications per year

2006–2007

4

Publications

4

Electromigration statistics and damage evolution for Pb-free solder joints with Cu and Ni UBM in plastic flip-chip packages

Seung‐Hyun Chae, Xuefeng Zhang, Kuan-Hsun Lu et al. · Journal of Materials Science Materials in Electronics · 2006 · 38 citations

Materials Science, Electrical Engineering, Electromigration Technique +12

Electromigration Lifetime Statistics for Pb-Free Solder Joints with Cu and Ni UBM in Plastic Flip-Chip Packages

Seung‐Hyun Chae, Xuefeng Zhang, Huang-Lin Chao et al. · 2006 · 20 citations

Engineering, Plastic Flip-chip Packages, Advanced Packaging (Semiconductors) +17

Multi-level step and flash imprint lithography for direct patterning of dielectrics

Frank L. Palmieri, M. D. Stewart, Jeff Wetzel et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 2006 · 14 citations

Direct Patterning, Engineering, Electron-beam Lithography +21

Photocurable silicon-based materials for imprinting lithography

Jianjun Hao, Michael W. Lin, Frank L. Palmieri et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 2007 · 10 citations

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