J. K. Lin

Pb-free solders for flip-chip interconnects

D. R. Frear, Jihun Jang, J. K. Lin et al. · JOM · 2001 · 317 citations

Engineering, Electrical Engineering, Materials Engineering +14

Morphology, kinetics, and thermodynamics of solid-state aging of eutectic SnPb and Pb-free solders (Sn–3.5Ag, Sn–3.8Ag–0.7Cu and Sn–0.7Cu) on Cu

T. Y. Lee, Woon‐Seop Choi, K. N. Tu et al. · Journal of materials research/Pratt's guide to venture capital sources · 2002 · 253 citations

Natural Sciences, Materials Engineering, Materials Science +13

Failure Modes of Flip Chip Solder Joints Under High Electric Current Density

Cemal Basaran, H. Ye, Douglas C. Hopkins et al. · Journal of Electronic Packaging · 2004 · 51 citations

Engineering, Materials Engineering, Materials Science +17

Solid-state annealing behavior of two high-Pb solders, 95Pb5Sn and 90Pb10Sn, on Cu under bump metallurgy

Lakshmi N. Ramanathan, Jihun Jang, J. K. Lin et al. · Journal of Electronic Materials · 2005 · 39 citations

Natural Sciences, Materials Engineering, Materials Science +10

Direct correlation between microstructure and mechanical tensile properties in Pb-free solders and eutectic SnPb solder for flip chip technology

Jin‐Wook Jang, A. P. De Silva, T. Y. Lee et al. · Applied Physics Letters · 2001 · 30 citations

Natural Sciences, Materials Engineering, Materials Science +17