J. K. Lin

Pb-free solders for flip-chip interconnects

D. R. Frear, Jihun Jang, J. K. Lin et al. · JOM · 2001 · 316 citations

Electrical Engineering, Engineering, Advanced Packaging (Semiconductors) +5

Morphology, kinetics, and thermodynamics of solid-state aging of eutectic SnPb and Pb-free solders (Sn–3.5Ag, Sn–3.8Ag–0.7Cu and Sn–0.7Cu) on Cu

T. Y. Lee, Woon‐Seop Choi, K. N. Tu et al. · Journal of materials research/Pratt's guide to venture capital sources · 2002 · 252 citations

Materials Science, Engineering, Pb-free Solders +8

Failure Modes of Flip Chip Solder Joints Under High Electric Current Density

Cemal Basaran, H. Ye, Douglas C. Hopkins et al. · Journal of Electronic Packaging · 2004 · 51 citations

Materials Science, Advanced Packaging, Electrical Engineering +12

Solid-state annealing behavior of two high-Pb solders, 95Pb5Sn and 90Pb10Sn, on Cu under bump metallurgy

Lakshmi N. Ramanathan, Jihun Jang, J. K. Lin et al. · Journal of Electronic Materials · 2005 · 38 citations

Materials Science, Materials Engineering, Electrical Engineering +8

Direct correlation between microstructure and mechanical tensile properties in Pb-free solders and eutectic SnPb solder for flip chip technology

Jin‐Wook Jang, A. P. De Silva, T. Y. Lee et al. · Applied Physics Letters · 2001 · 29 citations

Materials Science, Brittle Fracture, Flip Chip Technology +15