Concepedia

H. Ye

HY

Statistics

Publications

1

Citations

51

H-Index

1

Active since

2004

Affiliations

University at Buffalo, State University of New York(Current)

H. Ye is an author at University at Buffalo, State University of New York specializing in engineering, advanced packaging, and electronic packaging.

Top concepts

Publications per year

2004–2004

1

Publications

1

Failure Modes of Flip Chip Solder Joints Under High Electric Current Density

Cemal Basaran, H. Ye, Douglas C. Hopkins et al. · Journal of Electronic Packaging · 2004 · 51 citations

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