Degradation of Cu6Sn5 intermetallic compound by pore formation in solid–liquid interdiffusion Cu/Sn microbump interconnects - Concepedia

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Degradation of Cu6Sn5 intermetallic compound by pore formation in solid–liquid interdiffusion Cu/Sn microbump interconnects

73

Citations

8

References

2013

Year

Iuliana Panchenko, Kristof Croes, Ingrid De Wolf, Joke De Messemaeker, Eric Beyne, Klaus-Juergen Wolter

Microelectronic Engineering

Materials EngineeringMaterials ScienceElectromigration TechniqueEngineeringInterconnect (Integrated Circuits)Applied PhysicsPore FormationInterfacial PhenomenaCu6sn5 Intermetallic CompoundMicrostructure

References

	Year	Citations

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