Toni T. Mattila

Impact of printed wiring board coatings on the reliability of lead-free chip-scale package interconnections

Toni T. Mattila, Vesa Vuorinen, J.K. Kivilahti · Journal of materials research/Pratt's guide to venture capital sources · 2004 · 95 citations

Electrical Engineering, Chip-scale Package, Engineering +7

Reliability of lead-free interconnections under consecutive thermal and mechanical loadings

Toni T. Mattila, J.K. Kivilahti · Journal of Electronic Materials · 2006 · 91 citations

Engineering, Hardware Reliability, Mechanical Engineering +8

Solid-State Reactions between Cu(Ni) Alloys and Sn

Vesa Vuorinen, Tomi Laurila, Toni T. Mattila et al. · Journal of Electronic Materials · 2007 · 84 citations

Materials Science, Materials Engineering, Engineering +6

Failure mechanisms of lead-free chip scale package interconnections under fast mechanical loading

Toni T. Mattila, J.K. Kivilahti · Journal of Electronic Materials · 2005 · 78 citations

Fast Mechanical Loading, Engineering, Chip-scale Package +9

Reliability of CSP Interconnections Under Mechanical Shock Loading Conditions

Toni T. Mattila, Pekka Marjamäki, J.K. Kivilahti · IEEE Transactions on Components and Packaging Technologies · 2006 · 76 citations

Engineering, Mechanical Engineering, Reliability Engineering +18