Statistics
Publications
6
Citations
148
H-Index
6
Active since
2019
Anke Hanisch is an author at Fraunhofer Institute for Reliability and Microintegration specializing in electronic packaging, microelectronics, and engineering.
Publications per year
2019–2023
6
6
Low Temperature Cu Interconnect with Chip to Wafer Hybrid Bonding
Guilian Gao, Laura Mirkarimi, Thomas Workman et al. · 2019 · 62 citations
Microstructure Development of Cu/SiO₂ Hybrid Bond Interconnects After Reliability Tests
Iuliana Panchenko, Laura Wenzel, Maik Mueller et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2022 · 20 citations · Full text
Engineering, Integrated Circuits, Interconnect (Integrated Circuits) +16
Process and Design Challenges for Hybrid Bonding
Vikas Dubey, Dirk Wünsch, Knut Gottfried et al. · ECS Transactions · 2023 · 16 citations · Full text
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