Anke Hanisch

Statistics

Publications

Citations

152

H-Index

Active since

2019

Affiliations

Fraunhofer Institute for Reliability and Microintegration(Current)

Fraunhofer Institute for Electronic Nano Systems

Technische Universität Dresden

Chemnitz University of Technology

Anke Hanisch is an author at Fraunhofer Institute for Reliability and Microintegration specializing in semiconductor devices, interconnect technology, and materials science.

Publications per year

2019–2023

Publications

Low Temperature Cu Interconnect with Chip to Wafer Hybrid Bonding

Guilian Gao, Laura Mirkarimi, Thomas Workman et al. · 2019 · 63 citations

Engineering, Materials Engineering, Materials Science +16

Enabling D2W / D2D Hybrid Bonding on manufacturing equipment based on simulated process parameters

Catharina Rudolph, Anke Hanisch, M. Voigtlander et al. · 2021 · 23 citations

Engineering, Manufacturing Engineering, Materials Science +17

Microstructure Development of Cu/SiO₂ Hybrid Bond Interconnects After Reliability Tests

Iuliana Panchenko, Laura Wenzel, Maik Mueller et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2022 · 21 citations · Full text

Engineering, Materials Engineering, Materials Science +17

Process and Design Challenges for Hybrid Bonding

Vikas Dubey, Dirk Wünsch, Knut Gottfried et al. · ECS Transactions · 2023 · 17 citations · Full text

Engineering, Electrical Engineering, Materials Engineering +16

Grain Structure Analysis of Cu/SiO<sub>2</sub> Hybrid Bond Interconnects after Reliability Testing

Iuliana Panchenko, Laura Wambera, Maik Mueller et al. · 2020 · 14 citations

Engineering, Materials Engineering, Materials Science +16

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