Statistics
Publications
6
Citations
120
H-Index
6
Active since
1997
Knut Gottfried is an author at Chemnitz University of Technology specializing in interconnect technology, materials engineering, and materials science.
Publications per year
1997–2023
6
6
Process and Design Challenges for Hybrid Bonding
Vikas Dubey, Dirk Wünsch, Knut Gottfried et al. · ECS Transactions · 2023 · 17 citations · Full text
Engineering, Electrical Engineering, Materials Engineering +16
Impact of Dielectric and Copper Via Design on Wafer-to-Wafer Hybrid Bonding
Vikas Dubey, Dirk Wünsch, Knut Gottfried et al. · 2023 · 14 citations
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