Stefan E. Schulz - Concepedia

Author

Stefan E. Schulz

Also Known As

Lena Schäfer, S E Schulz, S Schulz, S. E. Schulz, S. SCHULZ, S. Schulz, S.E Schulz, S.E. Schulz, Samantha Schulz, Schulz S.

323

Publications

2.7K

Citations

H-Index

103

Concepts

All Affiliations

Chemnitz University of Technology Fraunhofer Institute for Electronic Nano Systems Leibniz Institute for Solid State and Materials Research Helmholtz-Zentrum Dresden-Rossendorf Fraunhofer Institute for Reliability and Microintegration

About

Stefan E. Schulz is an author at Chemnitz University of Technology specializing in engineering, materials science, and applied physics.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	21	67	1.7K
2	Applied Physics	20	37	1.1K
3	Chemistry	16	30	513
4	Chemical Engineering	15	20	440
5	Natural Sciences	5	5	109

Stefan E. Schulz

Publications

2.1K

Citations

H-Index

Page 1

	Year	Citations
Optimizing sonication parameters for dispersion of single-walled carbon nanotubes Haibo Yu, Sascha Hermann, Stefan E. Schulz, Chemical Physics EngineeringCarbon-based MaterialNanomaterialsApplied PhysicsSonication Parameters	2012	132
Copper Oxide Films Grown by Atomic Layer Deposition from Bis(tri-n-butylphosphane)copper(I)acetylacetonate on Ta, TaN, Ru, and SiO[sub 2] Thomas Waechtler, Steffen Oswald, Nina Roth, Journal of The Electrochemical Society	2009	83
Electrical Conductivity Modeling of Graphene-based Conductor Materials Leo Rizzi, Andreas Zienert, Jörg Schuster, ACS Applied Materials & Interfaces Materials ScienceGraphene NanomeshesElectrical EngineeringEngineeringNanomaterials	2018	72
Comparison of techniques to characterise the density, porosity and elastic modulus of porous low-k SiO2 xerogel films Christopher P. Murray, C.M. Flannery, I. Streiter, Microelectronic Engineering Materials EngineeringMaterials ScienceElastic ModulusPore StructureEngineering	2002	71
High-resolution inkjet printing of conductive carbon nanotube twin lines utilizing evaporation-driven self-assembly Nghia Dinh, Enrico Sowade, Thomas Blaudeck, Carbon Materials ScienceEvaporation-driven Self-assemblyEngineeringCarbon-based MaterialMicrofabrication	2015	67
Thermal conductivity of ultra low-k dielectrics Annekatrin Delan, M. Rennau, Stefan E. Schulz Microelectronic Engineering Electrical EngineeringEngineeringApplied PhysicsThermodynamicsThermal Conduction	2003	63
Investigations regarding Through Silicon Via filling for 3D integration by Periodic Pulse Reverse plating with and without additives Lutz Hofmann, Ramona Ecke, Stefan E. Schulz Microelectronic Engineering Materials SciencePhotonicsSilicon Via FillingEngineeringPeriodic Pulse Reverse	2010	57
Development of different copper seed layers with respect to the copper electroplating process Karl Weiss, Stephan Riedel, Stefan E. Schulz, Microelectronic Engineering Materials ScienceElectrometallurgyChemical EngineeringEngineeringElectrochemistry	2000	57
ALD-grown seed layers for electrochemical copper deposition integrated with different diffusion barrier systems Thomas Waechtler, Shao-Feng Ding, Lutz Hofmann, Microelectronic Engineering Materials ScienceChemical EngineeringEngineeringSurface ElectrochemistryElectrochemical Copper Deposition	2010	54
High-performance giant magnetoresistive sensorics on flexible Si membranes Nicolás Pérez, Michael Melzer, Denys Makarov, Applied Physics Letters Magnetic PropertiesEngineeringMechanical EngineeringSilicon On InsulatorMagnetoelastic Materials	2015	48

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