A. Redolfi

Cu pumping in TSVs: Effect of pre-CMP thermal budget

Ingrid De Wolf, Kristof Croes, Olalla Varela Pedreira et al. · Microelectronics Reliability · 2011 · 137 citations

Engineering, Materials Engineering, Materials Science +9

Benchmarking SOI and bulk FinFET alternatives for PLANAR CMOS scaling succession

T. Chiarella, Liesbeth Witters, A. Mercha et al. · Solid-State Electronics · 2010 · 120 citations

Engineering, Computer Engineering, Electrical Engineering +14

Comprehensive analysis of the impact of single and arrays of through silicon vias induced stress on high-k / metal gate CMOS performance

A. Mercha, Geert Van der Plas, Victor Moroz et al. · 2010 · 119 citations

Engineering, Computer Engineering, Electrical Engineering +17

Improvement of data retention in HfO<inf>2</inf>/Hf 1T1R RRAM cell under low operating current

Yang Yin Chen, Masanori Komura, R. Degraeve et al. · 2013 · 96 citations

Engineering, Electrical Engineering, Materials Science +11

Vacancy-modulated conductive oxide resistive RAM (VMCO-RRAM): An area-scalable switching current, self-compliant, highly nonlinear and wide on/off-window resistive switching cell

B. Govoreanu, A. Redolfi, L. Zhang et al. · 2013 · 78 citations

Engineering, Electrical Engineering, Materials Science +16