Concepedia
Statistics
Publications
24
Citations
582
H-Index
16
Active since
2006
Affiliations
IMEC(Current)
KU Leuven
Delft University of Technology
Kansai University
Yann Civale is an author at IMEC specializing in semiconductor devices, materials science, and engineering.
Publications per year
2006–2013
Electroless Cu deposition on atomic layer deposited Ru as novel seed formation process in through-Si vias
Fumihiro Inoue, Harold Philipsen, Aleksandar Radisic et al. · Electrochimica Acta · 2013 · 57 citations
Engineering, Materials Engineering, Materials Science +17
3-D Wafer-Level Packaging Die Stacking Using Spin-on-Dielectric Polymer Liner Through-Silicon Vias
Yann Civale, Deniz Sabuncuoglu Tezcan, Harold Philipsen et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2011 · 50 citations
Engineering, Electrical Engineering, Materials Science +14
Void-Free Filling of HAR TSVs Using a Wet Alkaline Cu Seed on CVD Co as a Replacement for PVD Cu Seed
Silvia Armini, Zaid El-Mekki, K. Vandersmissen et al. · Journal of The Electrochemical Society · 2010 · 39 citations
Natural Sciences, Materials Engineering, Materials Science +16
Impact of through silicon via induced mechanical stress on fully depleted Bulk FinFET technology
Wei Guo, Geert Van der Plas, Alojz Ivankoviç et al. · 2012 · 36 citations
Engineering, Electrical Engineering, Electronic Materials +16
Enhanced barrier seed metallization for integration of high-density high aspect-ratio copper-filled 3D through-silicon via interconnects
Yann Civale, Silvia Armini, Harold Philipsen et al. · 2012 · 35 citations
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