Publication | Closed Access
Electroless Cu deposition on atomic layer deposited Ru as novel seed formation process in through-Si vias
56
Citations
37
References
2013
Year
Materials ScienceEpitaxial GrowthEngineeringNanoelectronicsSurface ScienceApplied PhysicsSemiconductor Device FabricationThrough-si ViasChemical Vapor DepositionElectronic PackagingChemical DepositionMicroelectronicsAtomic LayerElectroless Cu DepositionSilicon On Insulator
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