Huma Ashraf - Concepedia

Author

Huma Ashraf

SPTS Technologies (United Kingdom)

Also Known As

Huma Ashraf

Publications

709

Citations

H-Index

Concepts

All Affiliations

SPTS Technologies (United Kingdom)IMEC Swansea University Cardiff University

About

Huma Ashraf is an author at SPTS Technologies (United Kingdom) specializing in engineering, applied physics, and microfabrication.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	9	9	263
2	Applied Physics	8	8	180
3	Electrical Engineering	4	4	114
4	Materials Science	4	4	67
5	Biomedical Engineering	1	1	83

Huma Ashraf

Publications

647

Citations

H-Index

Page 1

	Year	Citations
<title>Advanced silicon etching using high-density plasmas</title> Jy Bhardwaj, Huma Ashraf Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE	1995	231
Hollow silicon microneedle fabrication using advanced plasma etch technologies for applications in transdermal drug delivery Chris Bolton, Olivia Howells, G.J. Blayney, Lab on a Chip	2020	127
Design, fabrication, and characterisation of a silicon microneedle array for transdermal therapeutic delivery using a single step wet etch process Olivia Howells, G.J. Blayney, Benedetta Gualeni, European Journal of Pharmaceutics and Biopharmaceutics Tissue EngineeringEngineeringMicrofabricationBiofabricationTransdermal Therapeutic Delivery	2021	83
Extreme Wafer Thinning and nano-TSV processing for 3D Heterogeneous Integration Anne Jourdain, Filip Schleicher, Joeri De Vos, EngineeringDevice IntegrationExtreme Wafer ThinningExtreme WaferWafer Scale Processing	2020	57
Advanced deep reactive‐ion etching technology for hollow microneedles for transdermal blood sampling and drug delivery Yufei Liu, P. F. Eng, Owen James Guy, IET Nanobiotechnology	2013	26
Characterization of Extreme Si Thinning Process for Wafer-to-Wafer Stacking Fumihiro Inoue, Anne Jourdain, Joeri De Vos, Materials ScienceWafer Scale ProcessingEngineeringSi ThicknessAdvanced Packaging (Semiconductors)	2016	24
Plasma Etching of Tapered Features in Silicon for MEMS and Wafer Level Packaging Applications Ha-Duong Ngo, André Hiess, V. Seidemann, Journal of Physics Conference Series Electrical EngineeringWafer Scale ProcessingEngineeringMicrofabricationTapered Features	2006	23
Extreme wafer thinning optimization for via-last applications Anne Jourdain, Joeri De Vos, Fumihiro Inoue, EngineeringExtreme WaferInterconnect (Integrated Circuits)Wafer Scale ProcessingAdvanced Packaging (Semiconductors)	2016	17
Demonstration of a collective hybrid die-to-wafer integration using glass carrier Samuel Suhard, Koen Kennes, Pieter Bex, EngineeringDevice IntegrationDaisy ChainsIntegrated CircuitsInterconnect (Integrated Circuits)	2021	17
Refractive index graded anti-reflection coating for solar cells based on low cost reclaimed silicon Yufei Liu, Owen James Guy, Jash Patel, Microelectronic Engineering Materials ScienceEngineeringRefractive IndexAnti-reflection CoatingApplied Physics	2013	16

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