Filip Schleicher

Extreme Wafer Thinning and nano-TSV processing for 3D Heterogeneous Integration

Anne Jourdain, Filip Schleicher, Joeri De Vos et al. · 2020 · 57 citations

Engineering, Device Integration, Extreme Wafer Thinning +19

Wafer-Scale Hybrid Integration of InP DFB Lasers on Si Photonics by Flip-Chip Bonding with sub-300nm Alignment Precision

Aleksandrs Marinins, Sebastian Hänsch, Hüseyin Şar et al. · IEEE Journal of Selected Topics in Quantum Electronics · 2022 · 52 citations · Full text

Optical Materials, Engineering, Device Integration +23

Localized states in advanced dielectrics from the vantage of spin- and symmetry-polarized tunnelling across MgO

Filip Schleicher, Ufuk Halisdemir, D. Lacour et al. · Nature Communications · 2014 · 46 citations · Full text

Materials Science, Magnetism, Spintronics +12

Buried Power Rail Integration With FinFETs for Ultimate CMOS Scaling

Anshul Gupta, Olalla Varela Pedreira, Goutham Arutchelvan et al. · IEEE Transactions on Electron Devices · 2020 · 36 citations

Engineering, Vlsi Design, Integrated Circuits +16

Disentangling Magnetic Hardening and Molecular Spin Chain Contributions to Exchange Bias in Ferromagnet/Molecule Bilayers

S. Boukari, Hashim Jabbar, Filip Schleicher et al. · Nano Letters · 2018 · 34 citations · Full text