Demonstration of a collective hybrid die-to-wafer integration

Abstract

In this paper, a collective hybrid bonding of a die to wafer is demonstrated. The key integration steps such as CMP, wet etch, cleaning, defect metrology, alignment optimization in die to wafer and wafer to wafer bonding tools are discussed in detail. Finally void free Cu to Cu and SiCN-SiCN connection is shown in this paper. Promising electrical yield more than 85% is obtained for the daisy chains containing 219 pad connections.