Andy Miller

Scalable, sub 2μm pitch, Cu/SiCN to Cu/SiCN hybrid wafer-to-wafer bonding technology

Eric Beyne, Soon-Wook Kim, Lan Peng et al. · 2017 · 135 citations

Engineering, Materials Engineering, Materials Science +14

Novel Cu/SiCN surface topography control for 1 μm pitch hybrid wafer-to-wafer bonding

Soon-Wook Kim, Ferenc Fodor, N. Heylen et al. · 2020 · 96 citations

Engineering, Materials Engineering, Materials Science +17

Pupils’ causal attributions for difficult classroom behaviour

Andy Miller, Eamonn Ferguson, Irene Byrne · British Journal of Educational Psychology · 2000 · 94 citations · Full text

Social Sciences, Psychology, Secondary Education +15

Influence of Composition of SiCN as Interfacial Layer on Plasma Activated Direct Bonding

Fumihiro Inoue, Lan Peng, Serena Iacovo et al. · ECS Journal of Solid State Science and Technology · 2019 · 78 citations · Full text

Engineering, Materials Engineering, Materials Science +17

Extreme Wafer Thinning and nano-TSV processing for 3D Heterogeneous Integration

Anne Jourdain, Filip Schleicher, Joeri De Vos et al. · 2020 · 59 citations

Engineering, Computer Engineering, Electrical Engineering +17