Andy Miller

Scalable, sub 2μm pitch, Cu/SiCN to Cu/SiCN hybrid wafer-to-wafer bonding technology

Eric Beyne, Soon-Wook Kim, Lan Peng et al. · 2017 · 130 citations

Engineering, Integrated Circuits, Silicon On Insulator +16

Pupils’ causal attributions for difficult classroom behaviour

Andy Miller, Eamonn Ferguson, Irene Byrne · British Journal of Educational Psychology · 2000 · 94 citations · Full text

Novel Cu/SiCN surface topography control for 1 μm pitch hybrid wafer-to-wafer bonding

Soon-Wook Kim, Ferenc Fodor, N. Heylen et al. · 2020 · 92 citations

Engineering, Mechanical Engineering, Interconnect (Integrated Circuits) +18

Influence of Composition of SiCN as Interfacial Layer on Plasma Activated Direct Bonding

Fumihiro Inoue, Lan Peng, Serena Iacovo et al. · ECS Journal of Solid State Science and Technology · 2019 · 68 citations · Full text

Ultra-Fine Pitch 3D Integration Using Face-to-Face Hybrid Wafer Bonding Combined with a Via-Middle Through-Silicon-Via Process

Soon-Wook Kim, Mikael Detalle, Lan Peng et al. · 2016 · 57 citations

Engineering, Integrated Circuits, Interconnect (Integrated Circuits) +20