Concepedia
Statistics
Publications
2
Citations
27
H-Index
Active since
2018
Affiliations
IMEC(Current)
M. Liebens is an author at IMEC specializing in bonding alignment, electronic materials, and hybrid fabrication.
Publications per year
2018–2020
Demonstration of a collective hybrid die-to-wafer integration
Samuel Suhard, Alain Phommahaxay, Koen Kennes et al. · 2020 · 15 citations
Engineering, Electrical Engineering, Materials Science +16
In-Line Metrology for Characterization and Control of Extreme Wafer Thinning of Bonded Wafers
M. Liebens, Anne Jourdain, Joeri De Vos et al. · IEEE Transactions on Semiconductor Manufacturing · 2018 · 12 citations
Engineering, Manufacturing Engineering, Manufacturing Processes +16
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