John Slabbekoorn

Small Pitch, High Aspect Ratio Via-Last TSV Module

Stefaan Van Huylenbroeck, Michele Stucchi, Yunlong Li et al. · 2016 · 38 citations

3D Ic Architecture, Electrical Engineering, Wafer Scale Processing +14

Enabling Ultra-Thin Die to Wafer Hybrid Bonding for Future Heterogeneous Integrated Systems

Alain Phommahaxay, Samuel Suhard, Pieter Bex et al. · 2019 · 36 citations

Direct Assembly, Engineering, Interconnect (Integrated Circuits) +17

A Novel Fan-Out Concept for Ultra-High Chip-to-Chip Interconnect Density with 20-µm Pitch

Arnita Podpod, John Slabbekoorn, Alain Phommahaxay et al. · 2018 · 32 citations

Data Bandwidth, Engineering, Shift Evolution +16

3D Stacking Using Bump-Less Process for Sub 10um Pitch Interconnects

Jaber Derakhshandeh, Inge De Preter, Carine Gerets et al. · 2016 · 31 citations

Engineering, Micromechanics, Electrical Resistance Measurement +21

The Growing Application Field of Laser Debonding: From Advanced Packaging to Future Nanoelectronics

Alain Phommahaxay, Gerald Beyer, Iuliana Radu et al. · 2019 · 23 citations

Application Field, Engineering, Laser Applications +26