Arnita Podpod

A Novel Fan-Out Concept for Ultra-High Chip-to-Chip Interconnect Density with 20-µm Pitch

Arnita Podpod, John Slabbekoorn, Alain Phommahaxay et al. · 2018 · 32 citations

Data Bandwidth, Engineering, Shift Evolution +16

Advanced Dicing Technologies for Combination of Wafer to Wafer and Collective Die to Wafer Direct Bonding

Fumihiro Inoue, Alain Phommahaxay, Arnita Podpod et al. · 2019 · 23 citations

Engineering, Mechanical Engineering, Alternative Dicing Technologies +17

The Growing Application Field of Laser Debonding: From Advanced Packaging to Future Nanoelectronics

Alain Phommahaxay, Gerald Beyer, Iuliana Radu et al. · 2019 · 23 citations

Application Field, Engineering, Laser Applications +26

Morphological characterization and mechanical behavior by dicing and thinning on direct bonded Si wafer

Fumihiro Inoue, Arnita Podpod, Lan Peng et al. · Journal of Manufacturing Processes · 2020 · 16 citations

Materials Science, Wafer Scale Processing, Si Wafer +15

Development of compression molding process for Fan-Out wafer level packaging

Julien Bertheau, Duval Fabrice F.C., Tadashi Kubota et al. · 2020 · 14 citations

Materials Science, Industrial Design, Chip-scale Package +15