Serguei Stoukatch

3D integration by Cu-Cu thermo-compression bonding of extremely thinned bulk-Si die containing 10 μm pitch through-Si vias

Bart Swinnen, Wouter Ruythooren, Piet De Moor et al. · 2006 · 190 citations

Engineering, Mechanical Engineering, Extreme Wafer Thinning +19

Mechanical reliability of Au and Cu wire bonds to Al, Ni/Au and Ni/Pd/Au capped Cu bond pads

Petar Ratchev, Serguei Stoukatch, Bart Swinnen · Microelectronics Reliability · 2005 · 98 citations

Materials Engineering, Materials Science, Cu Wire Bonds +14

An Autonomous Sigfox Wireless Sensor Node for Environmental Monitoring

Laura Joris, F. Dupont, Philippe Laurent et al. · IEEE Sensors Letters · 2019 · 77 citations

Sensor Networks, Environmental Monitoring, Engineering +12

A mass sensor based on 3-DOF mode localized coupled resonator under atmospheric pressure

Yuan Wang, Chun Zhao, Chen Wang et al. · Sensors and Actuators A Physical · 2018 · 63 citations

Engineering, Atmospheric Pressure, Sensor Design +4

Droplet formation by squeezing in a microfluidic cross-junction

Stéphanie Van Loo, Serguei Stoukatch, Michaël Kraft et al. · Microfluidics and Nanofluidics · 2016 · 61 citations · Full text

Engineering, Microfabrication, Lab-on-a-chip +5