Concepedia

Paul Kettner

PK

4

Publications

97

Citations

4

H-Index

2006

Active since

Affiliations

EV Group (Austria)(Current)

Paul Kettner is an author at EV Group (Austria) specializing in engineering, materials science, and flexible electronics.

Top concepts

EngineeringMaterial Science3D Printing3D IntegrationMicroelectronicsMicrofabricationAdvanced PackagingComputer EngineeringElectronic PackagingFlexible Electronics

Publications per year

2006–2008

4

Publications

4

Temporary Bonding and DeBonding Enabling TSV Formation and 3D Integration for Ultra-thin Wafers

Stefan Pargfrieder, Paul Kettner, Mark Privett et al. · 2008 · 45 citations

Engineering, Ultra-thin Wafers, Interconnect (Integrated Circuits) +22

New Results on Plasma Activated Bonding of Imprinted Polymer Features for Bio MEMS Applications

Paul Kettner, R. Pelzer, T. Glinsner et al. · Journal of Physics Conference Series · 2006 · 24 citations · Full text

High Resolution, Engineering, Plasma Activated Bonding +21

New technologies for advanced high density 3D packaging by using TSV process

Paul Kettner, Bioh Kim, Stefan Pargfrieder et al. · 2008 · 15 citations

New Technologies, Engineering, Tsv Process +19

Wafer-to-Wafer Bonding Techniques: From MEMS Packaging to IC Integration Applications

R. Pelzer, Herwig Kirchberger, Paul Kettner · 2006 · 13 citations

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