Concepedia

Author

Bioh Kim

Kalispell Regional Medical Center

Also Known As

Bioh Kim

39

Publications

299

Citations

8

H-Index

28

Concepts

All Affiliations

Kalispell Regional Medical CenterEV Group (Austria)Evans Analytical Group (United States)
BK

About

Bioh Kim is an author at Kalispell Regional Medical Center specializing in materials science, engineering, and electronic packaging.

Top Concepts

#ConceptH-IndexPublicationsCitations

1

Engineering

8

8

250

2

Applied Physics

6

6

207

3

Chemical Engineering

1

1

28

4

Chemistry

1

1

28

5

Computer Engineering

1

1

15

Bioh Kim

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8

Publications

250

Citations

8

H-Index

YearCitations

Factors Affecting Copper Filling Process Within High Aspect Ratio Deep Vias for 3D Chip Stacking

Bioh Kim, Charles Sharbono, Tom Ritzdorf,

2006

87

Annealing temperature effect on the Cu-Cu bonding energy for 3D-IC integration

Eun‐Jung Jang, Jaewon Kim, Bioh Kim,

Metals and Materials International

2011

50

Electrodeposition of Near-Eutectic SnAg Solders for Wafer-Level Packaging

Bioh Kim, Tom Ritzdorf

Journal of The Electrochemical Society

2003

34

Electrochemically Deposited Tin-Silver-Copper Ternary Solder Alloys

Bioh Kim, Tom Ritzdorf

Journal of The Electrochemical Society

2002

28

New technologies for advanced high density 3D packaging by using TSV process

Paul Kettner, Bioh Kim, Stefan Pargfrieder,

2008

15

Electrical Waveform Mediated Through-Mask Deposition of Solder Bumps for Wafer Level Packaging

Bioh Kim, Tom Ritzdorf

Journal of The Electrochemical Society

2004

13

Advanced wafer bonding solutions for TSV integration with thin wafers

Bioh Kim, Thorsten Matthias, Markus Wimplinger,

2009

13

High Rate Copper Filling Within High Aspect Ratio Through Silicon Vias for 3-D Chip Stacking

Charles Sharbono, Bioh Kim, Tom Ritzdorf

ECS Meeting Abstracts

2006

10

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