Concepedia

Bioh Kim

BK

8

Publications

250

Citations

8

H-Index

2002

Active since

Affiliations

Kalispell Regional Medical Center(Current)

EV Group (Austria)

Evans Analytical Group (United States)

Bioh Kim is an author at Kalispell Regional Medical Center specializing in materials science, engineering, and electronic packaging.

Top concepts

EngineeringMaterial ScienceElectronic PackagingApplied PhysicsMicroelectronicsElectrical EngineeringSurface ScienceMicrofabrication3D PrintingMaterials Engineering

Publications per year

2002–2011

8

Publications

8

Factors Affecting Copper Filling Process Within High Aspect Ratio Deep Vias for 3D Chip Stacking

Bioh Kim, Charles Sharbono, Tom Ritzdorf et al. · 2006 · 87 citations

Engineering, Interconnect (Integrated Circuits), Copper Filling +16

Annealing temperature effect on the Cu-Cu bonding energy for 3D-IC integration

Eun‐Jung Jang, Jaewon Kim, Bioh Kim et al. · Metals and Materials International · 2011 · 50 citations · Full text

Materials Science, Materials Engineering, Electrical Engineering +14

Electrodeposition of Near-Eutectic SnAg Solders for Wafer-Level Packaging

Bioh Kim, Tom Ritzdorf · Journal of The Electrochemical Society · 2003 · 34 citations · Full text

Materials Science, Electrical Engineering, Near-eutectic Snag Solders +15

Electrochemically Deposited Tin-Silver-Copper Ternary Solder Alloys

Bioh Kim, Tom Ritzdorf · Journal of The Electrochemical Society · 2002 · 28 citations

Materials Engineering, Materials Science, Electrical Engineering +12

New technologies for advanced high density 3D packaging by using TSV process

Paul Kettner, Bioh Kim, Stefan Pargfrieder et al. · 2008 · 15 citations

New Technologies, Engineering, Tsv Process +19

Rows per page

1–5 of 8