Publication | Open Access

Annealing temperature effect on the Cu-Cu bonding energy for 3D-IC integration

Materials ScienceMaterials EngineeringElectrical EngineeringWafer Scale ProcessingEngineeringAdvanced Packaging (Semiconductors)3D Ic ArchitectureNanoelectronicsApplied PhysicsChip AttachmentTemperature EffectElectronic PackagingMicroelectronics3D-ic Integration3D IntegrationInterconnect (Integrated Circuits)Cu-cu Bonding Energy