Thorsten Matthias

Annealing temperature effect on the Cu-Cu bonding energy for 3D-IC integration

Eun‐Jung Jang, Jaewon Kim, Bioh Kim et al. · Metals and Materials International · 2011 · 52 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +15

Recent progress in thin wafer processing

Thomas Uhrmann, Thorsten Matthias, Markus Wimplinger et al. · 2013 · 16 citations

Engineering, Electrical Engineering, Manufacturing Engineering +9

Silicon-based wafer-level packaging for cost reduction of high brightness LEDs

Thomas Uhrmann, Thorsten Matthias, Paul Lindner · 2011 · 16 citations

Engineering, Electrical Engineering, Materials Science +17

Manufacturing of Steel-Reinforced Aluminum Products by Combining Hot Extrusion and Closed-Die Forging

Annika Foydl, Insa Pfeiffer, Matthias Kammler et al. · Key engineering materials · 2012 · 15 citations · Full text

Engineering, Manufacturing Engineering, Materials Engineering +17

CMOS image sensor wafer-level packaging

Thorsten Matthias, Gerald Kreindl, Viorel Drăgoi et al. · 2011 · 13 citations

Engineering, Electrical Engineering, Manufacturing Engineering +17