Viorel Drăgoi

Mechanisms for room temperature direct wafer bonding

Thomas Plach, Kurt Hingerl, Sajjad Tollabimazraehno et al. · Journal of Applied Physics · 2013 · 188 citations

Engineering, Materials Engineering, Materials Science +17

Adhesive wafer bonding for MEMS applications

Viorel Drăgoi, T. Glinsner, Gerald Mittendorfer et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 2003 · 50 citations

Engineering, Materials Engineering, Materials Science +17

Wafer-level plasma activated bonding: new technology for MEMS fabrication

Viorel Drăgoi, Gerald Mittendorfer, Christine Thanner et al. · Microsystem Technologies · 2007 · 40 citations

Engineering, Electrical Engineering, Materials Science +16

Low-Temperature Cu-Cu Wafer Bonding

Bernhard Rebhan, Günter Hesser, Jiri Duchoslav et al. · ECS Transactions · 2013 · 35 citations

Engineering, Materials Engineering, Materials Science +15

Low temperature GaAs/Si direct wafer bonding

Marin Alexe, Viorel Drăgoi, Manfred Reiche et al. · Electronics Letters · 2000 · 34 citations

Engineering, Materials Engineering, Materials Science +17